Copper (Cu) target are sputtered under vacuum to form layers in the manufacture of TP, semiconductors, sensors, circuit devices and decorations etc.
| Symbol | : | Cu |
| Purity | : | 4N+ |
| Form | : | Planar; Rotary |
| Color / Appearance | : | Reddish-orange, metallic |
| Typical Density | : | 8.57g/cm³ |
| Typical Dimension | : | Planar: D500mm Rotary: L4000mm Other dimensions available |
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